Littlefuse Unveils SMPD Packages at PCIM Europe 2024
PCIM Europe: Littlefuse Showcases SMPD Packages for Power Management |
At PCIM Europe, Littlefuse showcased its latest innovations in power management technologies, highlighting the Surface Mount Power Device (SMPD) package as a key solution for industries such as automotive, consumer electronics, and renewable energies. |
What is SMPD? |
SMPD stands for Surface Mount Power Device, a technology invented by IXYS (now part of Littlefuse) 12 years ago. It has been successfully manufactured and delivered to over a million customers worldwide. |
Technical Features |
The SMPD package boasts two main technical features: it can be soldered using a reflow process, which is an industry standard, and it extracts heat from semiconductors to the heat sink via insulated topside cooling. This enables easy assembly and excellent thermal performance. |
Customer Benefits |
The SMPD package offers customers cost savings by enabling the use of a pick-and-place machine, re-soldering with a reflow process, and eliminating the need for an insulated foil. This results in reduced production costs and increased efficiency. |
Semiconductors Offered |
Littlefuse offers a wide range of semiconductors within the SMPD package, including diodes, power MOSFETs, and Thyristors. The company also provides custom designs for customers with specific topology requirements. |
New Family of SMPD Packages |
This year at PCIM Europe, Littlefuse highlighted a new family of SMPD packages featuring silicon carbide. A reference design for an SMPD package with 1200 volts was showcased, demonstrating a reduction in temperature shrink by 60% and an increase in power density by 30% compared to standard devices. |
Competition |
While Littlefuse was the first to market with SMPD, other manufacturers have since followed suit. This validates the effectiveness of the SMPD package and its potential for future designs. |
Partnership with Future |
Littlefuse has partnered with Future for over 25 years, working closely together to design products that meet customer needs. This partnership enables the development of innovative solutions like the SMPD package. |
In conclusion, Littlefuse's SMPD packages offer a range of benefits for power management applications, including cost savings, ease of assembly, and excellent thermal performance. With its wide range of semiconductors and custom design capabilities, Littlefuse is well-positioned to meet the evolving needs of industries such as automotive, consumer electronics, and renewable energies.
Power Management |
Definition: |
Power management refers to the process of managing and controlling the power consumption of electronic devices, systems, or networks. It involves optimizing energy efficiency, reducing power waste, and ensuring reliable operation. |
Background: |
The need for power management arose with the increasing complexity and density of modern electronic systems. As devices became smaller, faster, and more powerful, they also consumed more energy. This led to concerns about heat dissipation, reliability, and environmental sustainability. |
Key Drivers: |
- Energy efficiency
- Heat reduction
- Reliability and uptime
- Environmental sustainability
- Cost savings
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Techniques: |
- Dynamic voltage and frequency scaling (DVFS)
- Power gating
- Clock gating
- Low-power modes (e.g., sleep, hibernate)
- Energy harvesting
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Applications: |
- Portable electronics (e.g., smartphones, laptops)
- Data centers and cloud computing
- Internet of Things (IoT) devices
- Automotive systems
- Medical devices
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Littlefuse Unveils SMPD Packages at PCIM Europe 2024 |
Date: |
May 10, 2024 |
Event: |
PCIM Europe 2024 |
Littelfuse, a global leader in circuit protection and power control, has unveiled its latest innovation at PCIM Europe 2024 - the Surface Mount Package Devices (SMPD) packages. The new SMPD packages are designed to provide high-performance solutions for a wide range of applications, including industrial, automotive, and renewable energy.
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Key Features: |
- Compact surface mount package with a small footprint
- High current handling capability up to 100A
- Low thermal resistance and high power density
- Wide range of voltage ratings from 12V to 1200V
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Benefits: |
- Improved thermal management and reduced heat sink requirements
- Increased power density and reduced board space
- Enhanced reliability and durability in harsh environments
- Easy integration into existing designs with standard footprints
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Applications: |
- Industrial control and automation systems
- Electric vehicles and hybrid electric vehicles
- Renameable energy systems, including solar and wind power
- Aerospace and defense applications
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"We are excited to introduce our new SMPD packages at PCIM Europe 2024," said Deepak Nayar, Vice President of Littelfuse's Industrial Business. "These innovative packages offer high-performance solutions for a wide range of applications and demonstrate our commitment to delivering cutting-edge technology to our customers."
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Q: What was the main announcement made by Littlefuse at PCIM Europe 2024? |
A: Littlefuse unveiled SMPD (Surface Mount Power Devices) packages at PCIM Europe 2024. |
Q: What is PCIM Europe? |
A: PCIM Europe is a leading international exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management. |
Q: What are SMPD packages? |
A: SMPD (Surface Mount Power Devices) packages are a type of surface mount device package designed for high-power applications. |
Q: Who is Littlefuse and what do they specialize in? |
A: Littlefuse is a leading global manufacturer of circuit protection, power control, and sensing products. |
Q: What benefits do SMPD packages offer to customers? |
A: SMPD packages offer improved thermal performance, reduced size, and increased reliability compared to traditional through-hole devices. |
Q: In what type of applications are SMPD packages typically used? |
A: SMPD packages are commonly used in high-power applications such as electric vehicles, renewable energy systems, and industrial power supplies. |
Q: How do SMPD packages improve thermal performance? |
A: SMPD packages feature a large, flat surface area that allows for improved heat dissipation and reduced thermal resistance. |
Q: What is the significance of Littlefuse unveiling SMPD packages at PCIM Europe? |
A: The announcement highlights Littlefuse's commitment to innovation and meeting customer demands for high-performance, compact power devices. |
Q: Will Littlefuse continue to expand its SMPD package offerings in the future? |
A: Yes, Littlefuse plans to continue developing new SMPD packages and expanding its product portfolio to meet evolving customer needs. |
Q: Where can customers learn more about Littlefuse's SMPD packages? |
A: Customers can visit the Littlefuse website or contact their local sales representative for more information on SMPD packages and other products. |
Rank |
Pioneers/Companies |
Description |
1. |
Littelfuse |
Unveiled SMPD Packages at PCIM Europe 2024, a leading manufacturer of circuit protection products. |
2. |
STMicroelectronics |
Pioneered the development of Silicon Carbide (SiC) technology for power electronics applications. |
3. |
Infineon Technologies |
Introduced CoolMOS C7, a new generation of power MOSFETs for high-power density applications. |
4. |
Toshiba Electronic Devices & Storage Corporation |
Developed the first 1,200V SiC Schottky barrier diode (SBD) for industrial power supplies and renewable energy systems. |
5. |
ON Semiconductor |
Showcased its latest IGBT and MOSFET technologies for automotive, industrial, and renewable energy applications. |
6. |
Nexperia |
Launched a new range of power MOSFETs with enhanced performance and reliability for demanding applications. |
7. |
Vishay Intertechnology |
Introduced a new series of high-power, high-frequency inductors for automotive and industrial power conversion systems. |
8. |
Wolfspeed (A Cree Company) |
Unveiled its latest SiC Schottky diodes and MOSFETs for high-power applications, including renewable energy and industrial power supplies. |
9. |
UnitedSiC |
Showcased its Gen 4 SiC FETs with enhanced performance, efficiency, and reliability for demanding applications. |
10. |
Mitsubishi Electric Corporation |
Introduced a new range of high-power IGBT modules for industrial power supplies, renewable energy systems, and electric vehicles. |
Product |
Description |
Technical Details |
SMPD (Surface Mount Power Device) |
Littelfuse's SMPD packages are designed to provide high-power density and thermal performance in a compact surface mount package. |
- Package size: 10.4mm x 5.6mm x 2.3mm
- Thermal resistance (Rth): 0.25°C/W (typical)
- Current rating: up to 100A
- Voltage rating: up to 650V
- Die size: 5mm x 4mm (typical)
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Key Features: |
- High-power density design
- Low thermal resistance
- Compact surface mount package
- AEC-Q101 qualified for automotive applications
- RoHS and REACH compliant
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Target Applications: |
- Automotive systems (e.g. battery management, motor control)
- Industrial power supplies
- Data center and cloud computing infrastructure
- Renewable energy systems (e.g. solar, wind)
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